This website uses cookies so that we can provide you with the best user experience possible. Esec 3100 optima and esec 3100 plus wire bonder s for sale by. Its unprecedented productivity and process control are unmatched in the industry. Oerlikon is winner of the swiss technology award oerlikon. Levels of automation vary from completely manual to fully automatic. Esec brand whole series of gold thread and copper wire bonding machine for product for a 1.
Minimal distances between pick and bond positions coupled with the stiff symmetrical bondhead and vibration compensation provide the shortest. Esec 3018 wire bonder automated gold ball bonder type w1 esec 3018 awb automated gold ball bonder. Find the best deals on used esec 2008 xp, or send us a request for an item and we will contact you with matches available for sale. Of course this bonder family handles highend applications on bga substrates and to 12 wafers. Manual wire bonder workholders micro point pro ltd mpp. The fineplacer sigma embraces all features of an assembly and development platform capable of handling an unlimited spectrum of applications and prepared for future technologies. It is the most effortless system to run, assist and control production resulting in a quantum leap in throughput and yield at the lowest cost of ownership.
Esec wire bonder 3200 p5 set up for smart card application. Esec 3018 awb wire bonder automated gold ball bonder. Esec 3100 optima and esec 3100 plus wire bonder s tarasemi. The change pole can, wire clip transducer wire clamp, spark rod efo wand. Standard ball stitch wire bonding cycles were used as scalable and. D160 high performance pick and place xpp force controlled bondhead fcbh pick visionpv automatic wafer loader. The bonding base material can be leadframe used for leaded packages or btfr4 substrate used for bga products or packages. Product description esec 31003100plus bonders several sets available were deinstalled. Tool configuration shown is accurate to the knowledge of ges associates llc. Wire bonding equipment centre for advanced materials joining.
Set introduces fc300r high accuracy device bonder with robotics fc300r. It is the most effortless system to run, assist and control production resulting in a quantum leap in. Please contact sgc equipment directly for pictures. However, the reported transfer printing processes typically involve manual operation andor. Automatic wire bonders esec 3100 ballwedge bonder specifications.
D160 high performance pick and place xpp force controlled bondhead fcbh. The change pole can, wire clip transducer wire clamp, spark rod efo wand, sparking box efo box 2. Esec 3018 awb wire bonder automated gold ball bonder type w1. Cookie information is stored in your browser and performs functions such as recognising you when you return to our website and helping our team to understand which.
Flexible production soic up to singulated bga and more. Kruszyska m, bachmatiuk a and kaleczuk r j 2008 characterization. We are an interactive memberdriven website with thousands of avid users. Apr 18, 2017 multicopter afro esc calibration process with tgy 9x and d8rxp. Optionally, the accuracy can even be improved, down to 15. High productivity uph up to 8000 for matrix leadframes wo obc, odc excellent performance.
As a solutions provider, they support specific applications with highly accurate and innovative systems. It is the most effortless system to run, assist and control production resulting in a. Mpp introduces its workholder catalog for manual wire bonder applications. Flying bondhead operates by means of a frictionless air bearing. Transfer printing of nanomaterials and microstructures using a wire. Equipmatching is a marketplace for used, surplus and refurbished equipment, machinery and spare parts. Ndc international represents the mpp micro point pro ltd line of manual wire bonders in the usa, mexico and canada. With configurations ranging from manual to full automation, the fc150 provides development and production capabilities on a single upgradeable costeffective platform. You ought to hunker unmanful that she has had such an invitation. Power box power, all is named circuit board electro board, motor assembly which, image recognition system prs assembly. Cmtec is a valueadded reseller of used semiconductor assembly equipment. Chambasel, november 6, 2008 the innovation strength of the oerlikon group is being reaffirmed. The planarbump feature, a patented technology that uses gold wire to produce tailless ball bumps, also makes the 8000i wire bonder suitable for flip chip and other advanced packaging applications. Starting from manual to automatic, from adhesives to tools, exactly as.